High-Performance Heating: Optimized for high-intensity applications with a maximum temperature of 350°C.
Rapid Thermal Conductivity: Industrial-grade aluminum alloy ensures extremely fast heat-up times and high efficiency.
Exceptional Surface Flatness: CNC-machined surface provides optimal contact for vials, beakers, and specialized containers.
Rugged & Durable: The uncoated metallic surface is resistant to scratching, mechanical impact, and thermal cycling.
Uniform Heat Distribution: Advanced internal heating element configuration eliminates cold spots across the entire plate.
Brand :
NJbinglabItem No :
AA-DRB-400-300material :
Aluminum AlloySpecification :
400*300mmThe High-Temperature Aluminum Alloy Hot Plate (Uncoated) is a workhorse for laboratories and production facilities that prioritize speed and mechanical resilience. Unlike coated plates, this uncoated aluminum version is designed to handle the rigors of heavy-duty use, including the heating of metal molds, large glass vessels, and high-temperature reagents. Its superior thermal mass and conductivity allow it to reach its peak temperature of 350°C quickly and maintain it with high stability, making it ideal for high-throughput evaporation, baking, and curing processes.
Designed to integrate into versatile laboratory environments:
Glass & Metal Labware: The ideal platform for stainless steel beakers, aluminum blocks, and heavy borosilicate glassware.
PTFE & TFM Vessels: Suitable for controlled heating of high-pressure digestion vessels that require stable, high-energy thermal input.
PFA Racks: While PFA is sensitive to high heat, this plate can be used at lower regulated settings for batch drying of PFA components.
Material Science & Engineering: Curing of composite materials, resins, and heat-treating small metal components.
Petrochemical Labs: Flashpoint testing and the evaporation of high-viscosity oil samples.
General Chemistry: Rapid boiling of aqueous solutions and high-temperature synthesis involving organic solvents.
Electronics Manufacturing: Pre-heating of circuit boards (PCBs) and thermal testing of electronic assemblies.
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