Wafer Process

  Color: Pure white and opaque. Extreme Thermal Range: -200°C to +250°C. Chemical Resistance: Inert to concentrated HF, HNO3, and aggressive organic solvents. Chemical Purity: Made from ultra-pure PTFE, eliminating trace metal leaching for ppt-level. Ultra-smooth Surface: Non-stick interior ensures near-total sample recovery and effortless cleaning. Bespoke Configurations: Sizes, specifications, and capacities can be customized to meet specific application requirements.  

Extreme Purity: Extremely low trace metal leaching; safe for ppt-level cleanroom environments. Broad Temp Range: Maintains structural integrity from -200°C to +260°C. Chemical Resistance: Fully inert to concentrated HF, HNO3, and aggressive organic solvents. Hydrophobic Surface: Non-stick and easy to decontaminate, preventing cross-sample contamination.

1. ESD-Safe MaterialMade from anti-static polypropylene with controlled surface resistivity, effectively preventing electrostatic discharge and protecting sensitive wafers during handling. 2. 25-Slot Precision DesignStandard 25-slot structure ensures consistent wafer spacing and stable positioning, reducing wafer contact, scratches, and edge damage. 3. Cleanroom CompatibilityLow particle generation, low outgassing, and excellent chemical compatibility make it ideal for semiconductor cleanroom processes such as wet cleaning, rinsing, and drying. 4. Excellent Mechanical StabilityReinforced structure prevents deformation during handling, transport, and spin processes, ensuring reliable wafer alignment. 5. Optimized Open StructureOpen sidewalls and bottom drainage design enhance liquid flow and drying efficiency during wet processing. 6. Automation CompatibilityDesigned to meet standard cassette dimensions, compatible with automated wafer handling systems and equipment.  

Extreme Purity: Extremely low trace metal leaching; safe for ppt-level cleanroom environments. Broad Temp Range: Maintains structural integrity from -200°C to +260°C. Chemical Resistance: Fully inert to concentrated HF, HNO3, and aggressive organic solvents. Hydrophobic Surface: Non-stick and easy to decontaminate, preventing cross-sample contamination. By drilling small, uniformly sized holes into the cleaning tank, it can be used for filtration.

Secure Single-Wafer Holding: Designed to firmly hold one 6-inch wafer or a square plate, preventing slipping or misalignment during dipping processes. Ultra-Pure PTFE Construction: Made from pure PFA material, ensuring less metal ion leaching and compatibility with ultra-trace analysis environments. Excellent Chemical Resistance: Fully inert to aggressive acids such as HF, HNO₃, HCl, and organic solvents. Thermal Stability: Operates reliably across a wide temperature range (-200°C to +260°C), suitable for both ambient and heated chemical baths. User-Friendly Design: Ergonomic handle allows stable grip and precise control, enabling smooth insertion and removal of wafers without contamination. Non-Scratch Contact Structure:Carefully designed contact points minimize wafer surface damage while maintaining secure positioning.

Secure Single-Wafer Holding: Designed to firmly hold one 6-inch wafer or a square plate, preventing slipping or misalignment during dipping processes. Ultra-Pure PTFE Construction: Made from pure PTFE material, ensuring less metal ion leaching and compatibility with ultra-trace analysis environments. Excellent Chemical Resistance: Fully inert to aggressive acids such as HF, HNO₃, HCl, and organic solvents. Thermal Stability: Operates reliably across a wide temperature range (-200°C to +250°C), suitable for both ambient and heated chemical baths. User-Friendly Design: Ergonomic handle allows stable grip and precise control, enabling smooth insertion and removal of wafers without contamination. Non-Scratch Contact Structure:Carefully designed contact points minimize wafer surface damage while maintaining secure positioning.

Ultra-High Purity PTFE Material：Prevents metal ion leaching and particle contamination, suitable for cleanroom and semiconductor-grade applications. Excellent Chemical Resistance：Compatible with strong acids (HF, HNO₃, HCl) and aggressive reagents used in wafer processing. Thermal Stability：Withstands temperatures from -200°C to +260°C without deformation. Precision Fit Design：Tailored internal dimensions ensure secure placement of 25×25×3 mm wafers, minimizing movement and damage. Smooth, Non-Stick Surface：Reduces particle adhesion and facilitates easy cleaning.

Vertical Integrated Handle: Features a robust, upright PTFE handle for safe, manual immersion and retrieval from deep chemical baths. Precision-Slot Base: Designed with CNC-machined grooves or a perforated circular platform  to hold wafers securely with minimal surface contact. Maximum Chemical Circulation: The open-frame and multi-hole base design ensures rapid etchant flow and thorough rinsing of the substrate. 100% High-Purity PTFE: Offers total immunity to aggressive semiconductor chemicals including HF, BOE, and hot H3PO4. Bespoke Geometry: Fully customizable base diameters, slot widths and quantities, and handle lengths to accommodate specific wafer sizes or tank depths.

  Color: Pure white and opaque. Extreme Thermal Range: -200°C to +250°C. Chemical Resistance: Inert to concentrated HF, HNO3, and aggressive organic solvents. Chemical Purity: Made from ultra-pure PTFE, eliminating trace metal leaching for ppt-level. Ultra-smooth Surface: Non-stick interior ensures near-total sample recovery and effortless cleaning. Bespoke Configurations: Sizes, specifications, and capacities can be customized to meet specific application requirements.  

Precision Individual Handling: Specifically engineered for the safe pick-and-place of single wafers, preventing cross-contamination and surface damage. Superior Mechanical Strength: Made from high-performance PEEK, providing the rigidity and "spring-back" memory required for consistent gripping force. High-Heat Resilience: Capable of handling wafers directly from high-temperature processes (up to 260°C) without softening or deforming. Non-Marring Contact: The smooth PEEK tips are designed to grip wafers by the edges or underside without scratching sensitive layers or leaving metallic traces. Ergonomic Slide-Lock Design: Features a built-in sliding mechanism (only for 4") to lock the gripper in place, ensuring a fatigue-free and secure hold during transport.

Precision Individual Handling: Specifically engineered for the safe pick-and-place of single wafers, preventing cross-contamination and surface damage. Superior Mechanical Strength: Made from high-performance PEEK, providing the rigidity and "spring-back" memory required for consistent gripping force. High-Heat Resilience: Capable of handling wafers directly from high-temperature processes (up to 260°C) without softening or deforming. Non-Marring Contact: The smooth PEEK tips are designed to grip wafers by the edges or underside without scratching sensitive layers or leaving metallic traces. Ergonomic Slide-Lock Design: Features a built-in sliding mechanism (only for 6") to lock the gripper in place, ensuring a fatigue-free and secure hold during transport.

Precision Individual Handling: Specifically engineered for the safe pick-and-place of single wafers, preventing cross-contamination and surface damage. Superior Mechanical Strength: Made from high-performance PEEK, providing the rigidity and "spring-back" memory required for consistent gripping force. High-Heat Resilience: Capable of handling wafers directly from high-temperature processes (up to 260°C) without softening or deforming. Non-Marring Contact: The smooth PEEK tips are designed to grip wafers by the edges or underside without scratching sensitive layers or leaving metallic traces. Ergonomic Slide-Lock Design: Features a built-in sliding mechanism (only for 12") to lock the gripper in place, ensuring a fatigue-free and secure hold during transport.