Wafer Process

Precision Individual Handling: Specifically engineered for the safe pick-and-place of single wafers, preventing cross-contamination and surface damage. Superior Mechanical Strength: Made from high-performance PEEK, providing the rigidity and "spring-back" memory required for consistent gripping force. High-Heat Resilience: Capable of handling wafers directly from high-temperature processes (up to 260°C) without softening or deforming. Non-Marring Contact: The smooth PEEK tips are designed to grip wafers by the edges or underside without scratching sensitive layers or leaving metallic traces. Ergonomic Slide-Lock Design: Features a built-in sliding mechanism (only for 4") to lock the gripper in place, ensuring a fatigue-free and secure hold during transport.

Precision Individual Handling: Specifically engineered for the safe pick-and-place of single wafers, preventing cross-contamination and surface damage. Superior Mechanical Strength: Made from high-performance PEEK, providing the rigidity and "spring-back" memory required for consistent gripping force. High-Heat Resilience: Capable of handling wafers directly from high-temperature processes (up to 260°C) without softening or deforming. Non-Marring Contact: The smooth PEEK tips are designed to grip wafers by the edges or underside without scratching sensitive layers or leaving metallic traces. Ergonomic Slide-Lock Design: Features a built-in sliding mechanism (only for 6") to lock the gripper in place, ensuring a fatigue-free and secure hold during transport.

Precision Individual Handling: Specifically engineered for the safe pick-and-place of single wafers, preventing cross-contamination and surface damage. Superior Mechanical Strength: Made from high-performance PEEK, providing the rigidity and "spring-back" memory required for consistent gripping force. High-Heat Resilience: Capable of handling wafers directly from high-temperature processes (up to 260°C) without softening or deforming. Non-Marring Contact: The smooth PEEK tips are designed to grip wafers by the edges or underside without scratching sensitive layers or leaving metallic traces. Ergonomic Slide-Lock Design: Features a built-in sliding mechanism (only for 12") to lock the gripper in place, ensuring a fatigue-free and secure hold during transport.

Vertical Integrated Handle: Features a robust, upright PTFE handle for safe, manual immersion and retrieval from deep chemical baths. Precision-Slot Base: Designed with CNC-machined grooves or a perforated circular platform  to hold wafers securely with minimal surface contact. Maximum Chemical Circulation: The open-frame and multi-hole base design ensures rapid etchant flow and thorough rinsing of the substrate. 100% High-Purity PTFE: Offers total immunity to aggressive semiconductor chemicals including HF, BOE, and hot H3PO4. Bespoke Geometry: Fully customizable base diameters, slot widths, and handle lengths to accommodate specific wafer sizes or tank depths.

Exceptional Chemical Inertness: Fabricated from 100% high-purity PTFE, providing total resistance to concentrated HF, H2SO4, and BOE (Buffered Oxide Etch). Optimized Fluid Dynamics: Engineered with precision-milled slots and an open-frame design to ensure maximum chemical circulation and uniform rinsing. Surface Protection: The ultra-smooth, non-stick PTFE surface prevents wafer scratching and minimizes particle adhesion during processing. Thermal Stability: Maintains structural integrity in high-temperature chemical baths up to 250°C. Bespoke Customization: Fully tailorable slot pitch, pocket depth, and overall dimensions to accommodate any wafer size (2", 4", 6", 8") or non-standard substrate.

Exceptional Chemical Inertness: Fabricated from 100% high-purity PTFE, providing total resistance to concentrated HF, H2SO4, and BOE (Buffered Oxide Etch). Optimized Fluid Dynamics: Engineered with precision-milled slots and an open-frame design to ensure maximum chemical circulation and uniform rinsing. Surface Protection: The ultra-smooth, non-stick PTFE surface prevents wafer scratching and minimizes particle adhesion during processing. Thermal Stability: Maintains structural integrity in high-temperature chemical baths up to 250°C without leaching contaminants. Bespoke Customization: Fully tailorable slot pitch, pocket depth, and overall dimensions to accommodate any wafer size (2", 4", 6", 8") or non-standard substrate.

Exceptional Chemical Inertness: Fabricated from 100% high-purity PTFE, providing total resistance to concentrated HF, H2SO4, and BOE (Buffered Oxide Etch). Optimized Fluid Dynamics: Engineered with precision-milled slots and an open-frame design to ensure maximum chemical circulation and uniform rinsing. Surface Protection: The ultra-smooth, non-stick PTFE surface prevents wafer scratching and minimizes particle adhesion during processing. Thermal Stability: Maintains structural integrity in high-temperature chemical baths up to 250°C. Bespoke Customization: Fully tailorable slot pitch, pocket depth, and overall dimensions to accommodate any wafer size (2", 4", 6", 8") or non-standard substrate.

Exceptional Chemical Inertness: Fabricated from 100% high-purity PTFE, providing total resistance to concentrated HF, H2SO4, and BOE (Buffered Oxide Etch). Optimized Fluid Dynamics: Engineered with precision-milled slots and an open-frame design to ensure maximum chemical circulation and uniform rinsing. Surface Protection: The ultra-smooth, non-stick PTFE surface prevents wafer scratching and minimizes particle adhesion during processing. Thermal Stability: Maintains structural integrity in high-temperature chemical baths up to 250°C. Bespoke Customization: Fully tailorable slot pitch, pocket depth, and overall dimensions to accommodate any wafer size (2", 4", 6", 8") or non-standard substrate.

Exceptional Chemical Inertness: Fabricated from 100% high-purity PTFE, providing total resistance to concentrated HF, H2SO4, and BOE (Buffered Oxide Etch). Optimized Fluid Dynamics: Engineered with precision-milled slots and an open-frame design to ensure maximum chemical circulation and uniform rinsing. Surface Protection: The ultra-smooth, non-stick PTFE surface prevents wafer scratching and minimizes particle adhesion during processing. Thermal Stability: Maintains structural integrity in high-temperature chemical baths up to 250°C. Bespoke Customization: Fully tailorable slot pitch, pocket depth, and overall dimensions to accommodate any wafer size (2", 4", 6", 8") or non-standard substrate.

Exceptional Chemical Inertness: Fabricated from 100% high-purity PTFE, providing total resistance to concentrated HF, H2SO4, and BOE (Buffered Oxide Etch). Optimized Fluid Dynamics: Engineered with precision-milled slots and an open-frame design to ensure maximum chemical circulation and uniform rinsing. Surface Protection: The ultra-smooth, non-stick PTFE surface prevents wafer scratching and minimizes particle adhesion during processing. Thermal Stability: Maintains structural integrity in high-temperature chemical baths up to 250°C. Bespoke Customization: Fully tailorable slot pitch, pocket depth, and overall dimensions to accommodate any wafer size (2", 4", 6", 8") or non-standard substrate.

Exceptional Chemical Inertness: Fabricated from 100% high-purity PTFE, providing total resistance to concentrated HF, H2SO4, and BOE (Buffered Oxide Etch). Optimized Fluid Dynamics: Engineered with precision-milled slots and an open-frame design to ensure maximum chemical circulation and uniform rinsing. Surface Protection: The ultra-smooth, non-stick PTFE surface prevents wafer scratching and minimizes particle adhesion during processing. Thermal Stability: Maintains structural integrity in high-temperature chemical baths up to 250°C. Bespoke Customization: Fully tailorable slot pitch, pocket depth, and overall dimensions to accommodate any wafer size (2", 4", 6", 8") or non-standard substrate.

Exceptional Chemical Inertness: Fabricated from 100% high-purity PTFE, providing total resistance to concentrated HF, H2SO4, and BOE (Buffered Oxide Etch). Optimized Fluid Dynamics: Engineered with precision-milled slots and an open-frame design to ensure maximum chemical circulation and uniform rinsing. Surface Protection: The ultra-smooth, non-stick PTFE surface prevents wafer scratching and minimizes particle adhesion during processing. Thermal Stability: Maintains structural integrity in high-temperature chemical baths up to 250°C. Bespoke Customization: Fully tailorable slot pitch, pocket depth, and overall dimensions to accommodate any wafer size (2", 4", 6", 8") or non-standard substrate.